Power Integrations Introduces New Wide-Creepage Switcher IC for 800 V Automotive Applications

Power Integrations has introduced a wide-creepage packaging option for its InnoSwitch™3-AQ flyback switcher IC, which is designed for automotive applications. The IC is compliant with the IEC60664-1 standard in 800 V vehicles, and the need for conformal coating is eliminated by a wide drain-to-source-pin creepage distance of 5.1 mm. This simplifies manufacturing and increases system reliability.

The next iteration of EV bus voltages is supported by the new package’s increased primary-to-primary creepage and clearance distance between the drain and source pins. The InSOP™-28G package from Power Integrations is a unique design that allows for the provision of 1000 VDC to the primary side while simultaneously ensuring that all other pins are securely isolated in pollution degree 2 environments.

The CV/CC InnoSwitch3-AQ switching power supply ICs, which are rated at 1700 V, feature a silicon carbide (SiC) primary switch that is capable of generating up to 80 watts of output power. The highly integrated ICs reduce the number of components necessary to implement a power supply by up to 50%, thereby enhancing system reliability, saving space, and reducing component procurement challenges. In eAxle automotive applications, an increased drain-pin width is advantageous for withstanding elevated levels of shock and vibration.

New InnoSwitch3-AQ models can begin operating with as low as 30 V on the drain, eliminating the need for external circuitry—an essential feature for ensuring the devices’ functional safety. Input under-voltage, output over-voltage, and over-current limiting are further safety measures. More than 90% efficiency is achieved with synchronous rectification and a DC/DC-CM flyback controller that uses multi-mode valley switching. Even when not in use, devices use less than 15 milliwatts. The primary traction inverter’s emergency power supply, control circuits, µDC-DC converters, battery management systems, and other automotive applications are the targets. Remote on/off functionality has also been enhanced in the new ICs.

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