The Crucial Role of Thermal Paste in Power Electronics Cooling

Thermal paste is essential for effective heat dissipation in electronic systems, especially high-performance devices such as CPUs, GPUs, and power ICs.

Thermal paste is essential for effective heat dissipation in electronic systems, especially high-performance devices such as CPUs, GPUs, and power ICs. Placed between the electronic component and the heatsink, thermal paste fills in micro-irregularities in the surfaces, improving heat transfer. This is essential for maintaining optimal operating temperatures, preventing overheating, and prolonging the life of components. With different types available, from silicone-based to metal-based to ceramic-based, choosing the right product depends on the specific application.

Introduction

Even though many people are unaware of its relevance, thermal paste is crucial. A common mistake computer assemblers make is installing the heatsink directly on the CPU without using it. Helping the CPU (or other chips) transport heat to the heatsink is the primary purpose of thermal paste. Even if the two pieces are in close contact, forming air bubbles without the thermal paste would restrict the flow of heat. You shouldn’t give up if you don’t have thermal paste on hand. There are several practical, affordable, and easily accessible options to address the issue in the short term.

The purpose of the thermal paste is to fill up the tiny flaws on the surfaces that come into contact, which always causes the air particles to remain (see Figure 1). The CPU does not cool effectively because air is a poor heat conductor. A flawless and optimal adhesion between the CPU and heat sink is shown in Figure 1a. Real adhesion is shown in Figure 1b. The heat cannot escape because of the two surfaces’ flaws, which are minuscule and contain air bubbles of a blue hue. To convey the message, the flaws were purposefully shown in greater detail.