Power Integrations has introduced a wide-creepage packaging option for its InnoSwitch™3-AQ flyback switcher IC, which is designed for automotive applications....
Thermal paste is essential for effective heat dissipation in electronic systems, especially high-performance devices such as CPUs, GPUs, and power ICs....
Renesas Electronics Corporation has unveiled the RAA489118 buck-boost battery charger and the RAA489400 USB Type-C® port controller, forming a top-tier...
A new collaboration between VisIC Technologies and AVL aims to develop high-efficiency GaN inverter technology for the electric vehicle market....
Silicon Carbide (SiC) MOSFETs have emerged as a promising technology to address the increasing demand for high-efficiency and high-frequency power...
onsemi unveiled the Treo Platform, a mixed-signal and analog platform constructed on a cutting-edge 65nm node using Bipolar-CMOS-DMOS (BCD) process...
The next iteration of power modules for electric motor inverters is being proposed and optimized by Valeo and ROHM Semiconductor...